HYAMP^®

Ground Bond Testing made easy. Verify the integrity of your product’s ground circuitry with the New HYAMP Ground Bond Tester. From start to finish, Ground Bond Testing has never been more efficient, with on-board data storage, convenient front panel USB data collection, and front panel barcode connection capabilities. We’ve included AC and DC current capabilities within one Ground Bond Tester to improve testing flexibility. Interconnect the HYAMP Series with the Hypot^® Series to form a complete safety compliance system and maximize your workstation.