The Industry Leading Production Line Ground Bond Instrument
Verify the integrity of your product’s ground circuitry with the New HYAMP® Ground Bond Tester. Ground Bond Testing has never been more efficient with on-board data storage, convenient front panel USB data collection, and front panel barcode connection capabilities. We’ve included AC and DC current capabilities within one instrument to improve testing flexibility. Interconnect the HYAMP® Series with the Hypot® Series to form a complete safety compliance system.
We’ve improved the HYAMP® Series Ground Bond tester to provide 40 Amps of dual AC and DC current in the same instrument.
BENEFITS DESIGNED WITH YOU IN MIND
Take the pain out of your data transfer with on-board flash drive support and local data storage. Instantly import test files directly to your instrument during set-up. Save and record up to 1,500 test results directly from your instrument.
Barcode Capability Increase efficiency and production throughput by incorporating a barcode scan. A simple scan will associate your DUT with the test sequence and test data. Our barcode scan also supports concatenated barcodes.
Ground Bond Voltage Drop
Remove the math equations from your standards procedure. Our Ground Bond Voltage Drop feature calculates how much voltage is dropped across a ground circuit and converts the calculation into exactly the measurement you need.
AC and DC capability
Simplify your test routine with combined AC and DC test capability in one Ground Bond instrument.
A Match Made in
Interconnect your HYAMP® with a Hypot® instrument to form a seamless safety compliance test system.